ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,987, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device" was invented by Seongh... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,988, issued on April 7, was assigned to SEIKO EPSON Corp. (Japan). "Integrated circuit device" was invented by Takanori Iwawaki (Suwa, Japa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,989, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with patterned die backside layer" was inven... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,990, issued on April 7, was assigned to Littelfuse Inc. (Rosemont, Ill.). "Electrically isolated discrete package with high performance cer... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,991, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Liquid circulating cooling package substra... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,992, issued on April 7, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Terminal structure, method for manufacturing terminal st... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,993, issued on April 7, was assigned to KV Innovations LLC (Albuquerque, N.M.). "Three-dimensional integrated circuit" was invented by Kamb... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,994, issued on April 7, was assigned to Wolfspeed Inc. (Durham, N.C.). "Multilayer encapsulation for humidity robustness and related fabric... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,995, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,996, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Passive circuit on a back-end-of-line of a package" was invente... Read More